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Código de este producto: 7954692

Categoría: Soldadura - fuentes - flujo

Kester 83-1000-0186 Mildly Activated Rosin Liquid Flux Pen for Lead-Bearing and Lead Free Alloy, 0.33 fl. oz. (Color: Limited Edition)

(Kester 83-1000-0186 Mildly Activated Rosin Liquid Flux Pen for Lead-Bearing and Lead Free Alloy, 0.33 fl. oz.)

High activity.
Chemically compatible with most solder masks and board laminates.
pH Neutral Chemistry.
Classified as ORH1 per J-STD-004.



Color:

No disponible, aún no tenemos información acerca de próxima fecha de ingreso

Precio: Q249

 
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Kester 83-1000-0186 Mildly Activated Rosin Liquid Flux Pen for Lead-Bearing and Lead Free Alloy, 0.33 fl. oz. (Color: Limited Edition) Kester 83-1000-0186 Mildly Activated Rosin Liquid Flux Pen for Lead-Bearing and Lead Free Alloy, 0.33 fl. oz. (Color: Limited Edition) Kester 83-1000-0186 Mildly Activated Rosin Liquid Flux Pen for Lead-Bearing and Lead Free Alloy, 0.33 fl. oz. (Color: Limited Edition)
Kester 83-1000-0186 Mildly Activated Rosin Liquid Flux Pen for Lead-Bearing and Lead Free Alloy, 0.33 fl. oz. (Color: Limited Edition)

Descripción del fabricante

Kester 2331-ZX Flux Pen is designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies. Kester 2331-ZX is an innovation in organic acid water-soluble flux chemistry for soldering circuit board assemblies. This unique, neutral pH chemistry flux provides the best ionic cleanliness of any organic water-soluble flux available to the electronics industry. This popular flux has been used for soldering critical assemblies in the telecommunications, computer and other industries. No offensive odors will be emitted during soldering. Kester 2331-ZX will not create excessive foaming in standard water cleaning systems. Kester 2331-ZX has good soldering properties for improved productivity without sacrificing reliability of the assembly. This flux does not attack properly cured solder masks or FR-4 epoxy-glass laminate. Kester 2331-ZX is not detrimental to the surface insulation resistance of the soldered assembly. Use of this flux minimizes cleaning costs while complying with environmental regulations.

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